• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A pick and place for a ROM(Read Only Memory) write handler is to increase a processing speed by simultaneously sucking and mounting many semiconductor devices. CONSTITUTION: A pick and place for a ROM write handle comprises a head section(101) having a head row(110) and a lifting member(120), and a transferring section(102) for moving the head section between a tray and a socket of the a handler body. The head row includes a series of up-down cylinders fixed to each other by a supporting bracket(111). A ball spline shaft(114) is rotatively engaged to an end of rod of the cylinder. The ball spline shaft has on its lower end a suction head(115) for sucking and mounting a semiconductor. A driven pulley(116) is splined to an outer surface of the ball spline shaft, and is engaged to a driving pulley(118) through a timing belt(117). The lifting member includes a ball screw shaft(122), a z-axis servo motor(124), and a lifting part(126).
    公开号:KR20000055007A
    申请号:KR1019990003413
    申请日:1999-02-02
    公开日:2000-09-05
    发明作者:홍충훈；김두열
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Pick and Place for ROM write handler}
    BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a ROMlite handler for storing a program in a semiconductor device, such as a PROM or Flash memory, and more particularly to a semiconductor for storing a tray and a program in which the semiconductor device is mounted and moved. The invention relates to a pick and place for transferring a semiconductor device between sockets in which a chip is seated.
    In general, semiconductor devices, such as PROM or Flash memory, enter an initial program during the manufacturing process, and the program input process is automatically performed by a device called a ROM write handler. Is performed.
    That is, when the tray on which the semiconductor device is mounted is transferred to the ROMlite handler, the semiconductor device is transferred from the tray to the socket portion of the handler, and a program is input in a state of being mounted in each socket arranged in the socket portion. When the input of the program is completed, the semiconductor device is transferred from the socket portion to the tray and transferred to the next process along the conveyor line.
    Here, the work of transferring the semiconductor device between the tray and the socket portion is performed through a device called pick and place. An example of such pick and place is shown in FIG. 1.
    As shown, the pick and place comprises a head part 1 and a conveying part 2.
    The transfer part 2 is used to move the head part 1 between the tray (not shown) and the socket part (not shown) of the handler body, and a conventional XY robot is used.
    The head part 1 has two head trains 10 in which four adsorption heads 12 are arranged in a row, and the lifting means 20 and the head trains which raise and lower these head trains 10 up and down ( It has the rotation means 30 which rotates 10). The head row 10 has an up-down cylinder 14 for raising and lowering each adsorption head 12 in addition to the adsorption head 12 described above. The rotating means 30 includes a ball spline shaft 32 having a support bracket 16 supporting two head rows 10 at its lower end, and an R-axis servo motor for rotating the ball spline shaft 32 ( Has 34). The ball spline shaft 32 and the R-axis servo motor 34 are connected via a drive pulley 38, a driven pulley 36, and a timing belt 37. The driven pulley 36 is splined to one outer peripheral surface of the ball spline shaft 32. Lifting means 20 is a ball screw shaft 42 installed in a vertical direction on one side of the frame 41 to be conveyed by the transfer unit 2 and the Z-axis servo motor 44 for rotating the ball screw shaft 42, And an elevating member 46 supporting the upper end of the ball spline shaft 32 of the rotating means 30 so as to be movable along the ball screw shaft 42.
    The ball spline shaft is caused by the ball screw shaft 42 being rotated by the Z axis servo motor 44 and thus the elevating member 46 is moved along the ball screw shaft 42 in the vertical direction (Z axis direction). The head row 10 connected to the elevating member 46 is moved up and down through the 32. In addition, when the driving force of the R-axis servo motor 34 is transmitted to the driven pulley 36 through the drive pulley 38, the ball spline shaft 32 splined with the driven pulley 36 is rotated and supported at the lower end thereof. The head row 10 is rotated.
    In the pick-and-place for a romite handler having such a configuration, the head part 1 is moved between the tray and the socket part by the conveying part 2, and the suction head 20 is moved by the lifting means 20 and the up-down cylinder 14. 12 is raised and lowered and transfers the semiconductor device D between the tray and the socket portion by attracting or mounting the semiconductor device D. FIG. At this time, since the mounting direction of the semiconductor device mounted on the tray 3 and the mounting direction of the semiconductor device of the socket portion 4 generally have a difference of 90 ° with each other, as shown in FIG. 2A, the R-axis servo motor 34 controls the mounting direction by driving the ball spline shaft 32 to rotate the head row 10 by 90 degrees.
    However, conventionally, since the entire head row is rotated by the rotation of the ball spline shaft, when the pitch between the tray and the semiconductor device mounted on the socket is different from each other, even though the head has a plurality of adsorption heads, the plurality of the semiconductor devices are simultaneously adsorbed. And the impossible to mount.
    That is, for example, as shown in FIGS. 2A and 2B, the vertical pitch P ve between the semiconductor devices mounted on the tray 3 is 36 mm, the horizontal pitch P ho is 25 mm, and the vertical pitch of the socket portion. P sv is 36 mm, and the pitch P he between the heads of the head rows is 36 mm.
    In this case, the head 12 of the head row 10 cannot be adsorbed and mounted at the same time. That is, as shown in FIG. 2A, when the four rows of semiconductor devices D are simultaneously sucked from the tray 3 with the head rows 10 facing in the vertical direction, the head rows 10 are mounted when the head rows 10 are mounted in the socket portion 4. The head row 10 itself faces the horizontal direction in a state where the direction of the semiconductor device D adsorbed by the head 12 thereof is rotated so as to correspond to the mounting direction of the socket portion 4. Therefore, since the directions of the head row 10 and the socket portion 4 are perpendicular to each other, the plurality of semiconductor devices D adsorbed on the head row 10 cannot be mounted at the same time. It must be mounted while moving.
    Otherwise, as shown in FIG. 2B, when the semiconductor device D adsorbed on the head row 10 is to be mounted on the socket portion 4 at the same time, when the semiconductor device D is adsorbed from the tray 3, the head row is held. The column 10 must be adsorbed in a state in which it is oriented in the horizontal direction, but since the pitch P he between the heads 12 and the horizontal pitch P he of the tray 3 do not coincide with each other, It is impossible to adsorb the semiconductor device D at the same time.
    Accordingly, there is a disadvantage in that productivity is low due to a decrease in the work speed due to sequential adsorption or mounting when the semiconductor device D is transferred between the tray 3 and the socket portion 4.
    The present invention has been made in view of the above, and when picking up the semiconductor device between the tray and the socket portion, it is possible to simultaneously adsorb and simultaneously install the head row unit, and the pick-and-place for the romite handler which can improve the working speed The purpose is to provide.
    1 is a front view showing a pick and place for a conventional ROMlite handler.
    Figures 2a and 2b is a view for explaining the disadvantages of the pick and place for the conventional romite handler shown in Figure 1;
    Figure 3 is a front view showing a pick and place for a romite handler according to an embodiment of the present invention.
    4 is a view for explaining the operation of the present invention.
    Explanation of symbols on the main parts of the drawings
    101; Head 102; Conveying part
    103; Tray 104; Socket
    110; Head row 112; Up-down cylinder
    114; Ball spline shaft 115; Adsorption head
    119; R-axis servo motor 120; Lifting means
    122; Ball screw shafts 124; Z axis servo motor
    126; Elevating member D; Semiconductor devices
    The present invention for achieving the above object, the head portion having at least one head row of a plurality of adsorption heads for adsorbing and mounting the semiconductor device arranged in a row, and the lifting means for elevating the head row up and down, and And a conveying portion for horizontally moving the head portion between the tray and the socket portion of the handler body, wherein each suction head in the head row is rotated about its own axis of rotation. Therefore, even when the mounting direction of the semiconductor device of the tray and the mounting direction of the socket portion are different from each other, the head train can be simultaneously adsorbed and simultaneously mounted on a plurality of semiconductor devices.
    The head row includes a plurality of up-down cylinders, a plurality of ball spline shafts rotatably mounted on the rods of the plurality of up-down cylinders, a plurality of suction heads respectively installed at the ends of the plurality of ball spline shafts, and one side of the plurality of ball spline shafts. A plurality of driven pulleys each spline coupled; A driving pulley connected by a plurality of driven pulleys and a timing belt; And an R-axis drive motor for driving the drive pulley. When the driving force of the R-axis drive motor is transmitted to the plurality of driven pulleys through the drive pulley, the plurality of suction heads are rotated about the plurality of ball spline shafts on which they are installed.
    The lifting means has a ball screw shaft installed in a vertical direction, a Z-axis drive motor for rotating the ball screw shaft, and a lifting member that is lifted up and down according to the rotation of the ball screw shaft, and supports a head row. Here, the Z-axis drive motor is installed in parallel with the ball screw shaft and transmits its driving force to the ball screw shaft through the belt pulley. Accordingly, the head of the pick and place can be miniaturized.
    Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
    A pick and place for a romite handler according to an embodiment of the present invention is shown in FIG. 3. As shown, the pick and place according to the present invention includes a transfer part 102 and a head part 101, and the head part 101 is again elevated with at least one head row 110. Means 120.
    The transfer part 102 is used to move the head part 101 between the tray (not shown) and the socket part (not shown) of the handler body, and a normal XY robot is used.
    Looking at the head row 101, a plurality of up-down cylinders 112 are arranged in a row, these up-down cylinders 112 are fixed to each other by a support bracket 111. A plurality of ball spline shafts 114 are rotatably coupled to the rod ends of the plurality of up-down cylinders 112, respectively. At the lower end of each ball spline shaft 114, an adsorption head 115 for adsorbing and mounting a semiconductor device D such as a PROM or a flash memory is provided. In addition, a plurality of driven pulleys 116 are each splined to one side of the outer circumferential surface of the ball spline shaft 114. These plurality of driven pulleys 116 are connected to the drive pulley 118 via a timing belt 117. The drive pulley is driven by the R-axis servo motor 119.
    The lifting means 120 has a ball screw shaft 122, a Z-axis servo motor 124, and a lifting member 126. The ball screw shaft 122 and the Z-axis servo motor 124 are installed in parallel to each other in the vertical direction on one side of the frame 121 moved by the transfer unit 102, the driving force of the Z-axis servo motor 124 It is transmitted to the ball screw shaft 122 through the belt pulley assembly 127, 128, 129. The lifting member 126 is provided in the ball screw shaft 122. The elevating member 126 is moved up and down in accordance with the rotation of the ball screw shaft 122, the other side is coupled to a pair of up-down cylinder 112 located in the center of the head row 110, the head row 110 Support. Accordingly, when the Z-axis servo motor 124 is driven, the ball screw shaft 122 is rotated so that the elevating member 126 is lifted along the ball screw shaft 122, and thus the head row 110 connected to the elevating member 126. ) Is moved up and down.
    In the illustrated example, the number of heads 112 of the head row 110 is illustrated as four, but the number may be increased or decreased as necessary. Also, the number of head rows 110 may be generally two or more. In addition, although the R-axis servo motor 119 and the Z-axis servo motor 122 were used in the example of illustration, a pulse motor, a DC motor, a rotary cylinder, etc. can also be used instead of a servo motor. For reference, reference numeral 113 in the drawings is a bearing for rotatably supporting the ball spline shaft 114.
    Pick and place according to an embodiment of the present invention having such a configuration, each head 112 is a separate ball spline shaft 114 without the entire head row is rotated as in the prior art during the adsorption and mounting of the semiconductor device (D) ) Is rotated by the rotation axis, it is possible to simultaneously adsorb and simultaneously mount a plurality of semiconductor devices (D). This will be described in detail with reference to FIG. 4 as follows.
    As shown in FIG. 4, on the tray 103, a plurality of semiconductor devices D are arranged such that their long portions face the vertical direction, and the vertical pitch P ve between the semiconductor devices D is 36 mm, horizontally. P ho is 25 mm. Moreover, each socket of the socket part 104 is arrange | positioned so that a long part may face a horizontal direction, and the vertical pitch P sv is 36 mm. The head row 110 simultaneously adsorbs four semiconductor devices D in which four heads 115 are mounted in the vertical direction on the tray 103 in a state arranged in the vertical direction. When the adsorption of the semiconductor device D is completed, the head portion 101 is transferred to the socket portion 104 by the transfer portion 102. When the head portion 101 is transferred to the socket portion 104, the R-axis servo motor 119 is driven, and its driving force is transmitted to the plurality of driven pulleys 116 via the driving pulley 118 and the timing belt 117. And a plurality of ball spline shafts 114 and a plurality of heads 115 are rotated 90 degrees by the rotation of this driven pulley 116. When the head 115 is rotated by 90 °, the semiconductor device D adsorbed by the head 115 faces in the horizontal direction while its long portion is in the vertical direction. However, the head row 110 still remains arranged in the vertical direction. That is, only the direction of the semiconductor device D adsorbed to each head 115 is changed without changing the direction of the head row 110. Then, the entire head row 110 is lowered by the elevating means 120, and then a plurality of up-down cylinders 112 are operated at the same time, so that each head 115 of the head row 110 is connected to a socket at a corresponding position. The semiconductor device D is mounted. That is, a plurality of semiconductor devices D are mounted at the same time.
    According to the present invention as described above, a ball spline shaft corresponding thereto is provided for each head in the head row, and each head is rotated about its ball spline shaft, so that the direction of the head row is adsorbed in the unchanged state. The orientation of the device can be changed. Accordingly, since one head train can simultaneously adsorb and simultaneously mount a plurality of semiconductor devices, there is an advantage in that the work speed is greatly increased and the productivity is greatly improved.
    In addition, the pick and place of the present invention has an advantage that the ball screw shaft and the Z-axis servo motor are installed in parallel with each other, and the ball spline shaft is installed in the up-down cylinder, so that the overall size of the head portion can be reduced and miniaturized.
    In the above, certain preferred embodiments of the present invention have been illustrated and described. However, the present invention is not limited to the above-described embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the present invention as claimed in the claims. .
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] At least one head row in which a plurality of adsorption heads for adsorbing and mounting a semiconductor device are arranged in a line, a head part having lifting means for lifting the head row up and down, and the head part between a tray and a socket part of the handler body; And a transfer unit configured to move horizontally in each of the head rows, wherein each of the suction heads of the head row is rotated about its own axis of rotation, so that the head rows are plural semiconductor devices even when the mounting direction of the semiconductor device of the tray and the mounting direction of the socket part are different from each other. Pick and place for the romite handler, characterized in that the simultaneous adsorption and simultaneous mounting is possible.
    [2" claim-type="Currently amended] 2. A plurality of ball spline shafts as recited in claim 1, wherein the head row comprises: a plurality of up-down cylinders, a plurality of ball spline shafts rotatably mounted to rods of the plurality of up-down cylinders, respectively; A head, a plurality of driven pulleys each splined to one side of the plurality of ball spline shafts, a driving pulley connected to the plurality of driven pulleys and a timing belt, and an R-axis driving motor to drive the driving pulley, wherein the R-axis And a plurality of suction heads are rotated about a plurality of ball spline shafts in which the plurality of suction heads are transmitted by the driving force of a driving motor through the driving pulleys to the plurality of driven pulleys.
    [3" claim-type="Currently amended] According to claim 1, wherein the elevating means is a ball screw shaft installed in the vertical direction and the Z-axis drive motor for rotating the ball screw shaft, and is moved up and down in accordance with the rotation of the ball screw shaft, to support the head row And a Z-axis drive motor installed in parallel with the ball screw shaft and transmitting the driving force to the ball screw shaft through a belt pulley.
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    同族专利:
    公开号 | 公开日
    KR100530382B1|2005-11-22|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1999-02-02|Application filed by 윤종용, 삼성전자 주식회사
    1999-02-02|Priority to KR10-1999-0003413A
    2000-09-05|Publication of KR20000055007A
    2005-11-22|Application granted
    2005-11-22|Publication of KR100530382B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR10-1999-0003413A|KR100530382B1|1999-02-02|1999-02-02|Pick and Place for ROM write handler|
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